A varistor module includes a base, a case, and a varistor body. The base and the case are assembled with each other to form a closed space. The varistor body includes a plurality of ceramic chips and a bridging element. The ceramic chips are disposed in the closed space. Each ceramic chip has an electrode layer on two opposite sides, respectively. The bridging element has at least two bridging segments and a crossing segment. The bridging segments are connected to electrode layers of different ones of the ceramic chips. The crossing segment is disposed between the bridging segments.