Invention Grant
- Patent Title: Coil component
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Application No.: US15825460Application Date: 2017-11-29
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Publication No.: US10553340B2Publication Date: 2020-02-04
- Inventor: Min-Lian Kuo , Dao-Chuang Zhang , QiQi Yang , I-Feng Lin , Chi-Hsiang Chuang , Chao-Hung Hsu
- Applicant: CYNTEC CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC CO., LTD
- Current Assignee: CYNTEC CO., LTD
- Current Assignee Address: TW Hsinchu
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: CN201710044978 20170120
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F17/04 ; H01F17/00 ; H01G4/005 ; H01F27/02 ; H01F27/32 ; H01F41/066 ; H01F41/12 ; H01F27/28

Abstract:
A coil component includes a core member, a coil structure, at least one terminal electrode and a soldering member. The coil structure includes an insulating layer. A first portion of the coil structure is wound around the core member. The terminal electrode is mounted onto the core member. The terminal electrode includes a clamping portion and a supporting portion. The clamping portion includes a bent part for clamping a second portion of the coil structure. The supporting portion includes a protruding part. A conductive wire of a third portion of the coil structure is revealed. A soldering member covers the protruding part to connect the supporting portion to the conductive wire to form electrical connection between the coil structure and the terminal electrode.
Public/Granted literature
- US20180211756A1 COIL COMPONENT Public/Granted day:2018-07-26
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