Invention Grant
- Patent Title: Methods for manufacturing semiconductor devices
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Application No.: US16027692Application Date: 2018-07-05
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Publication No.: US10553434B2Publication Date: 2020-02-04
- Inventor: Jung Han Lee , Byoung-gi Kim , Jong Pil Kim , Kihwan Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2017-0177169 20171221
- Main IPC: H01L21/225
- IPC: H01L21/225 ; H01L21/02 ; H01L21/8238 ; H01L23/532 ; H01L21/762

Abstract:
A method for manufacturing a semiconductor device includes performing a first ion implantation process on a substrate to form a lower dopant region in the substrate, patterning the substrate having the lower dopant region to form active patterns, and performing a second ion implantation process on the active patterns to form an upper dopant region in an upper portion of each of the active patterns. The lower and upper dopant regions have a same conductivity type.
Public/Granted literature
- US20190198323A1 METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES Public/Granted day:2019-06-27
Information query
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