Invention Grant
- Patent Title: Non-porous copper to copper interconnect
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Application No.: US15686645Application Date: 2017-08-25
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Publication No.: US10553555B2Publication Date: 2020-02-04
- Inventor: Charles L. Arvin , Christopher D. Muzzy
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Law Offices of Ira D. Blecker, P.C.
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L23/00 ; H01L23/498
Abstract:
A semiconductor structure which includes a first semiconductor substrate having a first plurality of copper connectors; a second semiconductor substrate having a second plurality of copper connectors; and a joining structure joining the first plurality of copper connectors to the second plurality of copper connectors, the joining structure including a copper intermetallic mesh having pores filled with silver. There is also a method for joining two semiconductor substrates.
Public/Granted literature
- US20190067239A1 NON-POROUS COPPER TO COPPER INTERCONNECT Public/Granted day:2019-02-28
Information query
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