Invention Grant
- Patent Title: Electronics package having a multi-thickness conductor layer and method of manufacturing thereof
-
Application No.: US15962570Application Date: 2018-04-25
-
Publication No.: US10553556B2Publication Date: 2020-02-04
- Inventor: Risto Ilkka Tuominen , Arun Virupaksha Gowda
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Ziolkowski Patent Solutions Group, SC
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/485 ; H01L23/31

Abstract:
An electronics package includes an insulating substrate and electrical components coupled to a first surface of the insulating substrate. A multi-thickness conductor layer is formed on a second surface of the insulating substrate opposite the first surface. The multi-thickness conductor layer extends through vias in the insulating substrate to connect with contact pads of the electrical components. The multi-thickness conductor layer has a first thickness in a region proximate the first electrical component and a second thickness in a region proximate the second electrical component, the first thickness greater than the second thickness. The electronics package also includes a first redistribution layer having a conductor layer formed atop a portion of the multi-thickness conductor layer having the second thickness. A top surface of the conductor layer is co-planar with or substantially co-planar with a top surface of a portion of the multi-thickness conductor layer having the first thickness.
Public/Granted literature
- US20180240779A1 ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND METHOD OF MANUFACTURING THEREOF Public/Granted day:2018-08-23
Information query
IPC分类: