- 专利标题： Semiconductor device having multiple semiconductor chips laminated together and electrically connected
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申请号： US14776863申请日： 2014-03-18
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公开(公告)号： US10553560B2公开(公告)日： 2020-02-04
- 发明人: Mitsuhisa Watanabe
- 申请人： PS4 Luxco S.a.r.l.
- 申请人地址： IE Dublin
- 专利权人： LONGITUDE LICENSING LIMITED
- 当前专利权人： LONGITUDE LICENSING LIMITED
- 当前专利权人地址： IE Dublin
- 代理机构： Kunzler Bean & Adamson
- 优先权： JP2013-054901 20130318
- 国际申请： PCT/JP2014/057321 WO 20140318
- 国际公布： WO2014/148485 WO 20140925
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/00 ; H01L23/48 ; H01L23/498 ; H01L25/00
摘要：
A chip laminate in this semiconductor device has a structure consisting of a first semiconductor chip and a second semiconductor chip laminated together. The first semiconductor chip has a circuit-forming layer and a first bump electrode formed on one surface and a second bump electrode formed on the other surface. The second semiconductor chip has a circuit-forming layer and a third bump electrode formed on one surface and a fourth bump electrode formed on the other surface. The first semiconductor chip and the second semiconductor chip are laminated together such that the circuit-forming layer on the first semiconductor chip and the circuit-forming layer on the second semiconductor chip face each other and the first and third bump electrodes are electrically connected to each other.
公开/授权文献
- US20160035705A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR 公开/授权日：2016-02-04
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