Invention Grant
- Patent Title: Self-assembly of semiconductor die onto a leadframe using magnetic fields
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Application No.: US15693985Application Date: 2017-09-01
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Publication No.: US10553573B2Publication Date: 2020-02-04
- Inventor: Daniel Lee Revier , Steven Alfred Kummerl , Benjamin Stassen Cook
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Michael A. Davis, Jr.; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/367 ; H01L23/495 ; H01F7/02 ; H01F7/20 ; H01L25/00 ; H01L21/687
Abstract:
Integrated circuits may be assembled by placing a batch of integrated circuit (IC) die on a leadframe. Each of the IC die includes a magnetically responsive structure that may be an inherent part of the IC die or may be explicitly added. The IC die are then agitated to cause the IC die to move around on the leadframe. The IC die are captured in specific locations on the leadframe by an array of magnetic domains that produce a magnetic response from the plurality of IC die. The magnetic domains may be formed on the lead frame, or may be provided by a magnetic chuck positioned adjacent the leadframe.
Public/Granted literature
- US20190074270A1 Self-assembly of Semiconductor Die onto a Leadframe Using Magnetic Fields Public/Granted day:2019-03-07
Information query
IPC分类:
