Invention Grant
- Patent Title: Image sensor, stacked image sensor, image processing apparatus, and method of fabricating image sensor chip package
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Application No.: US15274077Application Date: 2016-09-23
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Publication No.: US10553635B2Publication Date: 2020-02-04
- Inventor: Min-jun Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2015-0137104 20150925
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L27/146 ; G11C29/00 ; H01L21/66 ; H04N5/357 ; H04N5/378 ; G11C17/16 ; G11C17/18
Abstract:
An image sensor includes a pixel array and a peripheral circuit. The peripheral circuit is electrically connected to the pixel array and includes a logic block and at least one redundancy block to replace the logic block when the logic block is a defective block.
Public/Granted literature
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