An apparatus for manufacturing a thermoelectric module is provided. The apparatus includes a thermoelectric element interposed between a lower substrate that includes a lower electrode and an upper substrate that includes an upper electrode. Additionally, the apparatus includes a first block that is configured to support the lower substrate and a second block that is configured to move vertically with respect to the first block and support the upper substrate. A jig is configured to position the thermoelectric element in connection with the upper electrode and the lower electrode.