Invention Grant
- Patent Title: Microphone with encapsulated moving electrode
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Application No.: US16000593Application Date: 2018-06-05
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Publication No.: US10555090B2Publication Date: 2020-02-04
- Inventor: Jochen Reinmuth , Vijaye Rajaraman , Daniel Meisel , Bernhard Gehl
- Applicant: Akustica, Inc. , Robert Bosch GmbH
- Applicant Address: US PA Pittsburgh DE Stuttgart
- Assignee: Akustica, Inc.,Robert Bosch GmbH
- Current Assignee: Akustica, Inc.,Robert Bosch GmbH
- Current Assignee Address: US PA Pittsburgh DE Stuttgart
- Agency: Maginot, Moore & Beck LLP
- Main IPC: B81C1/00
- IPC: B81C1/00 ; H04R1/28 ; H04R19/04 ; H04R19/00 ; H04R7/04
Abstract:
A MEMS microphone system with encapsulated movable electrode is provided. The MEMS microphone system comprises a MEMS sensor having an access channel, a plug, and first and second members. The access channel configured to receive the plug is formed on at least one of the first and second member. A vacuum having a pressure different from a pressure outside the MEMS sensor is formed between the first and second members.
Public/Granted literature
- US20180352341A1 Microphone with Encapsulated Moving Electrode Public/Granted day:2018-12-06
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