Invention Grant
- Patent Title: Link module for a scalable multiprocessor system
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Application No.: US16357976Application Date: 2019-03-19
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Publication No.: US10559904B1Publication Date: 2020-02-11
- Inventor: Le Gao , Yang Sun , Yepeng Chen
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H01R9/26
- IPC: H01R9/26 ; H01R12/77 ; H01R12/70

Abstract:
A scalable multiprocessor computing system includes first and second computing devices and a link module connecting the computing devices. The link module includes a guide connector that aligns and couples the first computing device with the second computing device in an orientation in which a printed circuit board assembly (PCBA) support housing wall of the first computing device faces a PCBA support housing wall of the second computing device, a bracket member that is connected along corresponding lengthwise sides of the first and second computing devices, and a cable connector that provides a signal connection between the processor of the first computing device and the processor of the second computing device. The guide connector is connected to the bracket member.
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