A printed circuit board (PCB) includes a substrate and a PCB connector footprint defined along a longitudinal axis and a lateral axis being subdivided into PCB column grouping footprints in columns parallel to the longitudinal axis. The PCB includes signal vias arranged in pairs along a signal pair axis. The pairs of signal vias are aligned in the columns parallel to the longitudinal axis and in rows parallel to the lateral axis. The signal pair axis is non-parallel to the lateral and longitudinal axes. The PCB includes ground vias with at least one ground via arranged between adjacent pairs of signal vias within the PCB column grouping footprints and at least one ground via is arranged between adjacent pairs of signal vias in adjacent PCB column grouping footprints. This orientation is to allow more spacing between the signal vias and some ground vias to enhance signal integrity.