Invention Grant
- Patent Title: Surface mount heatsink attachment
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Application No.: US16357475Application Date: 2019-03-19
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Publication No.: US10561045B2Publication Date: 2020-02-11
- Inventor: Neil Mammen , Fred M. Sommer , Ankur Shah
- Applicant: DOLBY LABORATORIES LICENSING CORPORATION
- Applicant Address: US CA San Francisco
- Assignee: Dolby Laboratories Licensing Corporation
- Current Assignee: Dolby Laboratories Licensing Corporation
- Current Assignee Address: US CA San Francisco
- Priority: EP18162523 20180319
- Main IPC: F21V15/00
- IPC: F21V15/00 ; H05K7/20 ; H05K1/02 ; H05K1/18 ; H05K5/00 ; G02F1/1335 ; H01L25/075 ; F21V29/70 ; F21Y105/16 ; F28F3/06 ; F21Y115/10
Abstract:
An electronic device includes a printed circuit board (PCB). One or more components mounted on at least one of a first side and a second side of the PCB. The first side and the second side are two opposite sides of the PCB. A plurality of solder blades mounted on the second side of the PCB one or more heatsinks inserted onto the plurality of solder blades mounted on the second side of the PCB.
Public/Granted literature
- US20190289755A1 Surface Mount Heatsink Attachment Public/Granted day:2019-09-19
Information query
