Invention Grant
- Patent Title: Polymeric rule die, and formulations therefor
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Application No.: US15129421Application Date: 2015-04-07
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Publication No.: US10562258B2Publication Date: 2020-02-18
- Inventor: Claudio Rottman , Natalia Zlotnikov
- Applicant: HIGHCON SYSTEMS LTD.
- Applicant Address: IL Yavne
- Assignee: HIGHCON SYSTEMS LTD.
- Current Assignee: HIGHCON SYSTEMS LTD.
- Current Assignee Address: IL Yavne
- Agency: Fourth Dimension IP
- Agent Daniel Feigelson
- Priority: GB1406197.2 20140407
- International Application: PCT/IB2015/052513 WO 20150407
- International Announcement: WO2015/155685 WO 20151015
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08F2/50 ; C08G61/04 ; B31F1/10 ; B29C48/03 ; B31B50/25 ; B29L31/00

Abstract:
Die and counter-die systems, polymeric rule dies for such systems, and polymeric formulations suitable for producing such rule dies using digital rule writing. There is provided a rule die for pressure-contacting of a cardboard workpiece surface, including: (a) a die body; and (b) at least one elongate polymeric rule, each rule having: (i) a first elongate base surface adhesively attached to a surface of the die body; and (ii) an elongate protrusion, distally protruding from the die body, the elongate protrusion having an elongate die surface, the elongate die surface including a polymeric material, the elongate die surface having a contact surface adapted to contact the workpiece surface; the contact surface having a length of at least 5 mm and a first width (W) within a range of 0.4 to 1.0 mm, the rule having a height (H) within a range of 1.0 to 4.5 mm; wherein, over a total length of the contact surface, the contact surface having at most 5 surface pocks/meter, the pocks having a diameter above 0.1 mm.
Public/Granted literature
- US20170113432A1 POLYMERIC RULE DIE, AND FORMULATIONS THEREFOR Public/Granted day:2017-04-27
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