Invention Grant
- Patent Title: Solvent-based low temperature heat seal coating
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Application No.: US15469928Application Date: 2017-03-27
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Publication No.: US10563086B2Publication Date: 2020-02-18
- Inventor: Darius K. Deak , Thomas L. Ruppert , Elaine Lo
- Applicant: Bostik, Inc.
- Applicant Address: US WI Wauwatosa
- Assignee: Bostik, Inc.
- Current Assignee: Bostik, Inc.
- Current Assignee Address: US WI Wauwatosa
- Agent Christopher R. Lewis
- Main IPC: C09D167/02
- IPC: C09D167/02 ; B05D3/00 ; B05D3/14 ; C08J7/04 ; C09D167/00

Abstract:
A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.
Public/Granted literature
- US20170198171A1 SOLVENT-BASED LOW TEMPERATURE HEAT SEAL COATING Public/Granted day:2017-07-13
Information query
IPC分类: