Invention Grant
- Patent Title: Woven material including bonding fibers
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Application No.: US15501926Application Date: 2015-07-12
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Publication No.: US10568396B2Publication Date: 2020-02-25
- Inventor: Yoji Hamada , Peter F. Coxeter , Ying-Liang Su , Edward Siahaan , Whitney D. Mattson , Naoto Matsuyuki
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Morgan, Lewis & Bockius LLP
- International Application: PCT/US2015/040077 WO 20150712
- International Announcement: WO2016/025110 WO 20160218
- Main IPC: A44C5/00
- IPC: A44C5/00 ; A44C27/00 ; D03D11/00 ; D03D15/00 ; D03D1/00 ; D03D3/00

Abstract:
A woven material (100) including bonding fibers (108) and a method of reinforcing woven material using bonding fibers is disclosed. The woven material (100) includes a plurality of warp threads (102), and at least one weft thread (104) coupled to the warp threads (102). The woven material (100) also includes a plurality of bonding fibers (108). The bonding fibers (108) are positioned in parallel with the warp threads (102), and/or in parallel with the weft thread(s) (104). Additionally, the bonding fibers (108) are formed from a material having a melting temperature that is lower than a melting temperature of the material(s) used to form the warp threads (102) and the weft thread(s) (104) of the woven material.
Public/Granted literature
- US20170224064A1 WOVEN MATERIAL INCLUDING BONDING FIBERS Public/Granted day:2017-08-10
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