Invention Grant
- Patent Title: Method for fabricating array substrate, array substrate, and display device
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Application No.: US16106064Application Date: 2018-08-21
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Publication No.: US10573669B2Publication Date: 2020-02-25
- Inventor: Meng Zhao
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Calfee, Halter & Griswold LLP
- Priority: CN201711338767 20171214
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/02 ; H01L21/3205 ; H01L21/3213 ; H01L29/786 ; G06F3/041 ; G06K9/00 ; H01L27/32 ; G06F3/044

Abstract:
A method for fabricating an array substrate includes: forming a first metal layer on a base substrate; forming an insulating layer of a silicon-containing organic material on the first metal layer; forming a second metal layer on the insulating layer; patterning the second metal layer by adopting an oxygen ion etching process to partially cover the insulating layer; and forming a silicon oxide layer, by the oxygen ion etching process, on a surface of the insulating layer not covered by the second metal layer.
Public/Granted literature
- US20190189648A1 METHOD FOR FABRICATING ARRAY SUBSTRATE, ARRAY SUBSTRATE, AND DISPLAY DEVICE Public/Granted day:2019-06-20
Information query
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