Invention Grant
- Patent Title: Flexible substrate with via hole formed in insulation layer, method for manufacturing flexible substrate, and display device
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Application No.: US15021604Application Date: 2015-08-17
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Publication No.: US10573704B2Publication Date: 2020-02-25
- Inventor: Peng Cai
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201510181051 20150416
- International Application: PCT/CN2015/087203 WO 20150817
- International Announcement: WO2016/165249 WO 20161020
- Main IPC: H01L27/13
- IPC: H01L27/13 ; H01L27/32 ; H01L51/52 ; H01L51/00 ; H01L51/56 ; H01L27/12
Abstract:
The present disclosure relates to a technical field of displaying, and provides a flexible substrate, a method for manufacturing the flexible substrate and a display device including the flexible substrate. The flexible substrate includes: a flexible base; and a plurality of insulation layers formed on the flexible base, wherein a via hole is formed in at least one of the insulation layers and filled with an organic material.
Public/Granted literature
- US20170069701A1 FLEXIBLE SUBSTRATE, METHOD FOR MANUFACTURING FLEXIBLE SUBSTRATE, AND DISPLAY DEVICE Public/Granted day:2017-03-09
Information query
IPC分类:
