Invention Grant
- Patent Title: Laser machining apparatus that machines surface of workpiece by irradiating laser beam thereon
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Application No.: US16144644Application Date: 2018-09-27
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Publication No.: US10576579B2Publication Date: 2020-03-03
- Inventor: Yasuo Nishikawa , Yoshihisa Kusumoto
- Applicant: BROTHER KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Aichi
- Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Aichi
- Agency: K&L Gates LLP
- Priority: JP2016-070461 20160331
- Main IPC: G05B19/4097
- IPC: G05B19/4097 ; B23K26/03 ; B23K26/352 ; B23K26/0622 ; B23K26/082 ; B23K26/12 ; B23K26/361 ; B23K26/08 ; B23K26/36 ; B23K101/06

Abstract:
In a laser machining apparatus, a scanner is configured to scan a laser beam emitted from a laser beam emission device. A first part of a workpiece is exposed through an opening formed in the workpiece. A controller is configured to perform: acquiring shape data indicative of a shape of the workpiece; acquiring machining pattern data indicative of a machining pattern to be machined on the first part; acquiring a length of the machining pattern based on the machining pattern data; calculating an unmachinable position on a setting surface using the length and the shape data, the unmachinable position resulting from a second part of the workpiece hindering the laser beam reaching the first part, at least a part of the machining pattern being unmachinable on the first part in a state where the workpiece is set on the unmachinable position; and displaying the unmachinable position on a display.
Public/Granted literature
- US20190022794A1 LASER MACHINING APPARATUS THAT MACHINES SURFACE OF WORKPIECE BY IRRADIATING LASER BEAM THEREON Public/Granted day:2019-01-24
Information query
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