Invention Grant
- Patent Title: Process compatibility improvement by fill factor modulation
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Application No.: US15502950Application Date: 2016-11-04
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Publication No.: US10579768B2Publication Date: 2020-03-03
- Inventor: Vladimir Levinski , Eitan Hajaj , Tal Itzkovich , Sharon Aharon , Michael E. Adel , Yuri Paskover , Daria Negri , Yuval Lubashevsky , Amnon Manassen , Myungjun Lee , Mark D. Smith
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Hodgson Russ LLP
- International Application: PCT/US2016/060626 WO 20161104
- International Announcement: WO2017/176314 WO 20171012
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L21/027 ; G03F7/20

Abstract:
Metrology targets and target design methods are provided, in which target elements are defined by replacing elements from a periodic pattern having a pitch p, by assist elements having at least one geometric difference from the replaced elements, to form a composite periodic structure that maintains the pitch p as a single pitch. Constructing targets within the bounds of compatibility with advanced multiple patterning techniques improves the fidelity of the targets and fill factor modulation enables adjustment of the targets to produce sufficient metrology sensitivity for extracting the overlay while achieving process compatibility of the targets.
Public/Granted literature
- US20180157784A1 Process Compatibility Improvement by Fill Factor Modulation Public/Granted day:2018-06-07
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