Embodiments of the present disclosure provide an organic light-emitting diode (OLED) packaging structure and a manufacturing method thereof. The OLED packaging structure includes: a substrate; an OLED, disposed on the substrate and including active and non-active display region; a packaging peripheral region, disposed on the substrate and packaging a portion except the OLED; a packaging region, disposed on the OLED and packaging the active display region of the OLED; and a packaging transition region, disposed between the packaging peripheral region and the packaging region and packaging the non-active display region of the OLED, wherein each of the three regions includes an packaging layer, and a thickness of the packaging layer of the packaging transition region is greater than the thickness of the packaging layer of the packaging peripheral region.