Invention Grant
- Patent Title: Crimp tooling having guide surfaces
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Application No.: US15496624Application Date: 2017-04-25
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Publication No.: US10581213B2Publication Date: 2020-03-03
- Inventor: Michael Morris , Neil Deming , Michael Gerst , Matthew Steven Houser , Alois Conte
- Applicant: TE CONNECTIVITY CORPORATION , TE CONNECTIVITY GERMANY GmbH
- Applicant Address: US PA Berwyn DE Bensheim
- Assignee: TE Connectivity Corporation,TE Connectivity Corporation GMBH
- Current Assignee: TE Connectivity Corporation,TE Connectivity Corporation GMBH
- Current Assignee Address: US PA Berwyn DE Bensheim
- Main IPC: H01R43/048
- IPC: H01R43/048

Abstract:
Crimp tooling includes an anvil and a wire crimper. The anvil includes a base and a tip with a cradle at the tip for supporting a terminal. The anvil has first and second anvil guide surfaces located relative to the cradle. The wire crimper has first and second legs on opposite sides of a crimp slot that receives the cradle and the terminal supported by the cradle. The wire crimper defines a crimp profile in the crimp slot configured to form the terminal during crimping. The first and second legs have first and second wire crimper guide surfaces, respectively. The first and second wire crimper guide surfaces are configured to engage the first and second anvil guide surfaces, respectively, to guide a position of the wire crimper relative to the anvil.
Public/Granted literature
- US20180309254A1 CRIMP TOOLING HAVING GUIDE SURFACES Public/Granted day:2018-10-25
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