Invention Grant
- Patent Title: Speaker module housing and manufacturing method thereof
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Application No.: US16083617Application Date: 2016-05-17
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Publication No.: US10582323B2Publication Date: 2020-03-03
- Inventor: Pengcheng Ji , Xinfeng Yang
- Applicant: GOERTEK INC.
- Applicant Address: CN Weifang, Shandong
- Assignee: GOERTEK INC.
- Current Assignee: GOERTEK INC.
- Current Assignee Address: CN Weifang, Shandong
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: CN201610160887 20160321
- International Application: PCT/CN2016/082369 WO 20160517
- International Announcement: WO2017/161653 WO 20170928
- Main IPC: H04R31/00
- IPC: H04R31/00 ; H04R1/02 ; H04R3/00

Abstract:
Disclosed are a speaker module housing and a manufacturing method thereof. The speaker module housing comprises an upper housing, a lower housing, an annular connection member and a plate member. The annular connection member comprises a fixing portion and a connection portion. A speaker unit assembling hole is formed in the upper housing. The fixing portion of the annular connection member is fixedly connected with the speaker unit assembling hole. The connection portion of the annular connection member is electrically connected with the plate member.
Public/Granted literature
- US20190098422A1 SPEAKER MODULE HOUSING AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-03-28
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