Invention Grant
- Patent Title: Cooling apparatus for electronic components
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Application No.: US16145625Application Date: 2018-09-28
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Publication No.: US10582645B1Publication Date: 2020-03-03
- Inventor: Benjamin Kufahl , Harvey Lunsman , Michael Scott
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Nolte Intellectual Property Law Group
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/02 ; H05K1/02

Abstract:
A cooling apparatus includes a plurality of containers and a plurality of connectors. Each connector connects adjacent containers of the plurality of containers. The cooling apparatus is installable in a computing device such that each electronic component to be cooled in the computing device is interposed between adjacent containers. Each container may include a body, an inlet, and an outlet. The body may include first and second ends and may define a chamber through which a coolant is to flow. The body may be expandable responsive to pressure from the coolant and deformable responsive to contacting one of the electronic components so as to conform to a profile of the electronic component. The inlet may be disposed at the first end of the body through which the coolant enters the chamber. The outlet may be disposed at the second end of the body through which the coolant exits the chamber.
Information query