Invention Grant
- Patent Title: Chip carrier configured for delamination-free encapsulation and stable sintering
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Application No.: US15723431Application Date: 2017-10-03
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Publication No.: US10586756B2Publication Date: 2020-03-10
- Inventor: Alexander Roth , Andreas Grassmann , Juergen Hoegerl , Angela Kessler
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102016118784 20161004
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/29 ; H01L23/00 ; H05K7/10 ; H01L23/31 ; H01L23/433 ; H01L21/56 ; H01L23/373
Abstract:
A chip carrier for carrying an electronic chip, wherein the chip carrier comprises a mounting section configured for mounting an electronic chip by sintering, and an encapsulation section configured for being encapsulated by an encapsulant.
Public/Granted literature
- US20180096919A1 Chip carrier configured for delamination-free encapsulation and stable sintering Public/Granted day:2018-04-05
Information query
IPC分类:
