Invention Grant
- Patent Title: Micro-LED transfer method and manufacturing method
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Application No.: US16071451Application Date: 2016-01-20
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Publication No.: US10586886B2Publication Date: 2020-03-10
- Inventor: Quanbo Zou
- Applicant: Goertek Inc.
- Applicant Address: CN Weifang
- Assignee: GOERTEK, INC.
- Current Assignee: GOERTEK, INC.
- Current Assignee Address: CN Weifang
- Agency: Rimon PC
- International Application: PCT/CN2016/071474 WO 20160120
- International Announcement: WO2017/124332 WO 20170727
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/48 ; H01L25/075 ; H01L23/00

Abstract:
A micro-LED (3r) transfer method and a manufacturing method are disclosed. The micro-LED (3r) transfer method comprises: forming a sacrificial post (4) on a micro-LED (3r) to be picked-up on a carrier substrate (1); bonding the micro-LED (3r) to be picked-up with a pickup substrate (5) via the sacrificial post (4); lifting-off the micro-LED (3r) to be picked-up from the carrier substrate (1); bonding the micro-LED (3r) on the pickup substrate (5) with a receiving substrate (12); and lifting-off the micro-LED (3r) from the pickup substrate (5). A complicated pickup head is not necessary, and the technical solution is relatively simple.
Public/Granted literature
- US20190027642A1 Micro-LED Transfer Method and Manufacturing Method Public/Granted day:2019-01-24
Information query
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