Invention Grant
- Patent Title: Packaged die stacks with stacked capacitors and methods of assembling same
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Application No.: US16017652Application Date: 2018-06-25
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Publication No.: US10593618B2Publication Date: 2020-03-17
- Inventor: Bok Eng Cheah , Mooi Ling Chang , Ping Ping Ooi , Jackson Chung Peng Kong , Wen Wei Lum
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: MYPI2017702405 20170629
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L49/02 ; H01L25/16 ; H01L23/00 ; H01G4/30 ; H01L25/065 ; H01G4/40 ; H01G4/38 ; H01L23/538 ; H01L23/50
Abstract:
A stacked-die and stacked-capacitor package vertically arranged capacitors to mirror a semiconductive-device stack. The stacked capacitor can be electrically coupled to one or more semiconductive devices in the stacked architecture.
Public/Granted literature
- US20190006277A1 PACKAGED DIE STACKS WITH STACKED CAPACITORS AND METHODS OF ASSEMBLING SAME Public/Granted day:2019-01-03
Information query
IPC分类:
