Invention Grant
- Patent Title: Metal pad modification
-
Application No.: US16390193Application Date: 2019-04-22
-
Publication No.: US10593639B2Publication Date: 2020-03-17
- Inventor: Krishna Tunga , Ekta Misra
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jared C. Chaney
- Main IPC: H01L23/00
- IPC: H01L23/00

Abstract:
The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.
Public/Granted literature
- US20190244923A1 METAL PAD MODIFICATION Public/Granted day:2019-08-08
Information query
IPC分类: