发明授权
- 专利标题: Protection device
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申请号: US15915522申请日: 2018-03-08
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公开(公告)号: US10593662B2公开(公告)日: 2020-03-17
- 发明人: Narumasa Soejima , Takashi Suzuki , Kengo Shima , Yosuke Kanie , Kazuya Adachi
- 申请人: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
- 申请人地址: JP Aichi
- 专利权人: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
- 当前专利权人: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
- 当前专利权人地址: JP Aichi
- 代理机构: Greenblum & Bernstein, P.L.C.
- 优先权: JP2017-046607 20170310
- 主分类号: H01L23/60
- IPC分类号: H01L23/60 ; H01L27/02 ; H01L23/64 ; H01L23/62 ; H01L49/02 ; H02H9/04 ; H01L29/74 ; H01L29/866
摘要:
A protection device includes a semiconductor substrate including a protection element; an insulating layer covering a surface of the semiconductor substrate; a conductive layer disposed in the insulating layer, and extending in a plane that is parallel with the surface of the semiconductor substrate; a passive element formed with an elongated conductor, curved in a plane that is parallel with the conductive layer, and located over the conductive layer; and an input terminal, an output terminal, and a ground terminal exposed in a surface of the insulating layer. One end of the passive element is electrically connected to the input terminal, the other end of the passive element and a high-potential-side terminal of the protection element are electrically connected to the output terminal, and a low-potential-side terminal of the protection element and the conductive layer are electrically connected to the ground terminal.
公开/授权文献
- US20180261592A1 PROTECTION DEVICE 公开/授权日:2018-09-13