- 专利标题： Methods, apparatus, and system for high-bandwidth on-mold antennas
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申请号： US16526778申请日： 2019-07-30
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公开(公告)号： US10594356B1公开(公告)日： 2020-03-17
- 发明人: Saquib Bin Halim , Md Sayed Kaysar Bin Rahim , Marcel Wieland
- 申请人： GLOBALFOUNDRIES INC.
- 申请人地址： KY Grand Cayman
- 专利权人： GLOBALFOUNDRIES INC.
- 当前专利权人： GLOBALFOUNDRIES INC.
- 当前专利权人地址： KY Grand Cayman
- 代理机构： Williams Morgan, P.C.
- 主分类号： H04B1/38
- IPC分类号： H04B1/38 ; H04B1/40 ; H01L23/66 ; H01L21/56 ; H01L23/48 ; H01L23/31 ; H01L23/552 ; H01L21/768
摘要：
A semiconductor device comprising an on-mold antenna for transmitting and/or receiving a millimeter-wave radio frequency signal is provided. The semiconductor device includes a semiconductor layer; a polymer layer proximal to the semiconductor layer; a mold proximal to the polymer layer; a plurality of nodes proximal to the semiconductor layer and distal to the polymer layer; an antenna disposed on the mold; and a conductive element providing electrical communication between the antenna and a first node. The mold may be from 500 μm to 1000 μm thick, such as from 750 μm to 800 μm thick, such as about 775 μm.
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