Invention Grant
- Patent Title: Apparatus and method of forming a compound structure
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Application No.: US16360929Application Date: 2019-03-21
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Publication No.: US10596736B2Publication Date: 2020-03-24
- Inventor: Benjamin Shane Bustle , Tyler B. Cater , Derek C. Krass , Scott A. Myers
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: A47B81/00
- IPC: A47B81/00 ; B29C45/14 ; B29K101/12 ; B29L31/34 ; H04M1/02

Abstract:
Compound structures and methods for forming the same are described. The compound structures can be used to form an enclosure. The enclosure may be formed from metal, such as aluminum, and further include one or more non-metal regions that allow for transmission and receipt of electromagnetic waves, such as radio frequency waves. The non-metal region can include a first section, a second section, and an optional cosmetic section. The first section can be firmly molded onto a metal section of the enclosure by small pores formed within the metal section. The second section can engage with interlock features of the first section. The optional cosmetic section can cover the first section and the second section such that the first section and the second section are not visible from an exterior of the enclosure.
Public/Granted literature
- US20190217513A1 APPARATUS AND METHOD OF FORMING A COMPOUND STRUCTURE Public/Granted day:2019-07-18
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