Invention Grant
- Patent Title: Urea solution pump module
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Application No.: US15710119Application Date: 2017-09-20
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Publication No.: US10598065B2Publication Date: 2020-03-24
- Inventor: Tae Hoon Lee , Ji Ho Jung , Jong Hyuk Yoon , Yong Soo Jeon
- Applicant: COAVIS
- Applicant Address: KR Sejong-si
- Assignee: COAVIS
- Current Assignee: COAVIS
- Current Assignee Address: KR Sejong-si
- Agency: The Webb Law Firm
- Priority: KR10-2016-0120482 20160921
- Main IPC: F01N3/20
- IPC: F01N3/20 ; B01D35/027 ; B01D35/26 ; H05B3/82 ; B60K15/03

Abstract:
Provided is a urea solution pump module including: a flange portion coupled to cover an opened mounting hole of a urea solution tank; a pump disposed near an upper surface of the flange portion; a filter formed to surround the pump, disposed to be spaced apart from the pump, and coupled to the flange portion; an internal heater disposed between the pump and the filter and coupled to the flange portion; and a first fin having one side connected to the internal heater and the other side disposed near the pump. If the urea solution received in the urea solution tank is frozen, the pump and the urea solution frozen around the pump may be quickly and efficiently thawed.
Public/Granted literature
- US20180080361A1 Urea Solution Pump Module Public/Granted day:2018-03-22
Information query
IPC分类: