Invention Grant
- Patent Title: Metrology guided inspection sample shaping of optical inspection results
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Application No.: US15671230Application Date: 2017-08-08
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Publication No.: US10598617B2Publication Date: 2020-03-24
- Inventor: Kaushik Sah , Andrew James Cross , Antonio Mani
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Hodgson Russ LLP
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G01N23/2251 ; H01L21/66 ; G01N21/956 ; G01N21/88 ; G01N21/95

Abstract:
Information from metrology tools can be used during inspection or review with a scanning electron microscope. Metrology measurements of a wafer are interpolated and/or extrapolated over a field, which creates modified metrology data. The modified metrology data is associated with defect attributes from inspection measurements of a wafer. A wafer review sampling plan is generated based on the defect attributes and the modified metrology data. The wafer review sampling plan can be used during review of a wafer using the scanning electron microscope.
Public/Granted literature
- US20180321168A1 Metrology Guided Inspection Sample Shaping of Optical Inspection Results Public/Granted day:2018-11-08
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