Invention Grant
- Patent Title: Electronic component
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Application No.: US16166902Application Date: 2018-10-22
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Publication No.: US10600570B2Publication Date: 2020-03-24
- Inventor: Shinya Onodera , Takehisa Tamura , Atsushi Takeda , Ken Morita
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2017-209365 20171030
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/232 ; H01F27/29 ; H05K3/12 ; H01G4/30 ; H01G4/005 ; H01F17/00

Abstract:
An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer. The external electrode includes a plating layer including a first portion covering the first principal surface and a pair of second portions covering the pair of side surfaces. A thickness of the first portion is smaller than each thickness of the pair of second portions.
Public/Granted literature
- US20190131070A1 ELECTRONIC COMPONENT Public/Granted day:2019-05-02
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