Invention Grant
- Patent Title: Semiconductor package including organic interposer
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Application No.: US15925338Application Date: 2018-03-19
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Publication No.: US10600706B2Publication Date: 2020-03-24
- Inventor: Dong Hun Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2017-0135957 20171019
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/16 ; H01L23/00 ; H01L25/16 ; H01L25/10 ; H01L25/18 ; H01L23/498

Abstract:
A semiconductor package including an organic interposer includes: the organic interposer including insulating layers and wiring layers formed on the insulating layers; a stiffener disposed on the interposer and having a through-hole; a first semiconductor chip disposed in the organic through-hole on the organic interposer; a second semiconductor chips disposed adjacent to the first semiconductor chip in the through-hole on the organic interposer; and an underfill resin filling at least portions of the through-hole and fixing the first semiconductor chip and the second semiconductor chip, wherein the connection pads of the first semiconductor chip and the second semiconductor chip are electrically connected to each other through the wiring layers of the organic interposer.
Public/Granted literature
- US20190122949A1 SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER Public/Granted day:2019-04-25
Information query
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