Invention Grant
- Patent Title: Flexible substrate structure, flexible transistor and method for fabricating the same
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Application No.: US15905729Application Date: 2018-02-26
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Publication No.: US10600915B2Publication Date: 2020-03-24
- Inventor: Wen-Hsien Huang , Jia-Min Shieh , Chang-Hong Shen
- Applicant: National Applied Research Laboratories
- Applicant Address: TW Taipei
- Assignee: National Applied Research Laboratories
- Current Assignee: National Applied Research Laboratories
- Current Assignee Address: TW Taipei
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/324 ; H01L21/02 ; H01L29/66 ; H01L23/538 ; H01L23/498 ; H01L29/423 ; H01L27/12

Abstract:
A flexible substrate structure including a flexible substrate, a first dielectric layer, a metal-containing layer and a second dielectric layer is provided. The first dielectric layer is located on the flexible substrate. The metal-containing layer has a reflectivity greater than 15% and a heat transfer coefficient greater than 2 W/m-K. The metal-containing layer is disposed between the first dielectric layer and the second dielectric layer, and the second dielectric layer is an inorganic material layer. A flexible transistor including the above-mentioned flexible substrate structure and a method for fabricating the same are also provided.
Public/Granted literature
- US20180248044A1 FLEXIBLE SUBSTRATE STRUCTURE, FLEXIBLE TRANSISTOR AND METHOD FOR FABRICATING THE SAME Public/Granted day:2018-08-30
Information query
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