Invention Grant
- Patent Title: Package structure, method for manufacturing the same, method for detecting package defect, OLED device and display apparatus
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Application No.: US16144085Application Date: 2018-09-27
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Publication No.: US10600992B2Publication Date: 2020-03-24
- Inventor: Jinyu Ren , Guojing Ma , Qi Wang
- Applicant: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Kinney & Lange, P.A.
- Priority: CN201711350463 20171215
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; G01N27/12 ; H01L51/00

Abstract:
The present application provides a package structure, a method for manufacturing the same, a method for detecting a package defect in the package structure, an OLED device, and a display apparatus. The package structure includes: a first cover plate and a second cover plate; a sealant disposed between the first cover plate and the second cover plate and configured to form a sealed space with the first cover plate and the second cover plate; a moisture detection portion located in the sealed space; a first electrode having one terminal connected to a portion of the moisture detection portion, and the other terminal extending beyond the sealed space; and a second electrode having one terminal connected to another portion of the moisture detection portion, and the other terminal extending beyond the sealed space.
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