发明授权
- 专利标题: Conductor module
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申请号: US16044729申请日: 2018-07-25
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公开(公告)号: US10601017B2公开(公告)日: 2020-03-24
- 发明人: Takao Ota , Kazuya Harakawa
- 申请人: Yazaki Corporation
- 申请人地址: JP Minato-ku, Tokyo
- 专利权人: YAZAKI CORPORATION
- 当前专利权人: YAZAKI CORPORATION
- 当前专利权人地址: JP Minato-ku, Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2017-151391 20170804
- 主分类号: H01M2/20
- IPC分类号: H01M2/20 ; H01M2/10 ; H01R25/16 ; H01M10/48 ; H01R11/28 ; H01R12/77 ; H01R12/55 ; H01R13/68
摘要:
A conductor module includes a wiring member, a plurality of bus bars, a plurality of locking pieces, and a reinforcing member. A plurality of wirings and through-holes are formed in the wiring member. The bus bar is electrically connected to one of two electrode terminals. The two through-holes are formed in a first opposing region opposing one end face between both end faces of the bus bar opposing each other in a width direction with an electrical connection portion where the bus bar and the wiring are electrically connected interposed therebetween. The locking piece is formed integrally with the bus bar, is arranged in the through-hole, has a distal end positioned radially outward of the through-hole, and fixes the bus bar to the wiring member. The reinforcing member reinforces the wiring member, and is formed to surround the through-hole.
公开/授权文献
- US20190044120A1 CONDUCTOR MODULE 公开/授权日:2019-02-07
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