According to an embodiment, a printed circuit board and an electronic device is disclosed. The printed circuit board includes a first pattern configured to be formed in a first layer. The printed circuit board also includes a second pattern configured to be formed in at least one second layer under the first layer. The printed circuit board also includes a via configured to electrically connect the first pattern to the second pattern. The printed circuit board further includes a recess configured to be formed by removing at least a portion of an area in which the via is formed and to electrically separate the first pattern from the second pattern.