A thermoforming apparatus is described herein. The apparatus may include a pressure mechanism, a thermal device, a plurality of individually actuatable pins, and/or a pin actuation mechanism. The pressure mechanism may create a force against a die surface. The thermal device may change a thermal state of a material forced by the pressure mechanism against the die surface. The plurality of individually actuatable pins may form the die surface. The pin actuation mechanism may be connected to the plurality of actuatable pins and/or may actuate the pins. This apparatus improves on prior solutions in many ways. For example, embodiments of the thermoforming apparatus may require significantly less time between different molds than previous thermoforming machines and 3D printers.