Invention Grant
- Patent Title: Printhead
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Application No.: US15749073Application Date: 2015-10-12
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Publication No.: US10603911B2Publication Date: 2020-03-31
- Inventor: Chien-Hua Chen , Michael W. Cumbie , Silam J. Choy
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2015/055086 WO 20151012
- International Announcement: WO2017/065725 WO 20170420
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/155

Abstract:
A printhead includes a moldable substrate, and a number of printhead dies molded into the moldable substrate. The printhead dies include a number of printhead dies molded into the moldable substrate. The dies comprise a non-rectangular shape. A number of fluid slots are defined in the moldable substrate to fluidically coupled to the printhead dies to feed fluid to the printhead dies. The number of fluid slots is not equal to the number of printhead dies.
Public/Granted literature
- US20180222194A1 PRINTHEAD Public/Granted day:2018-08-09
Information query
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