Invention Grant
- Patent Title: Coil component and board having the same
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Application No.: US15229315Application Date: 2016-08-05
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Publication No.: US10607765B2Publication Date: 2020-03-31
- Inventor: Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2015-0162370 20151119
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F10/00 ; H01F27/255 ; H01F17/00 ; H01F17/04 ; H01F27/29 ; H05K1/18 ; H01F19/04
Abstract:
A coil component and a board having the same are provided. The coil component includes: a first coil; a second coil sharing a magnetic core with the first coil; a main board disposed between the first and second coils; first and second external electrodes connected to the first coil; and third and fourth external electrodes connected to the second coil.
Public/Granted literature
- US20170148560A1 COIL COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2017-05-25
Information query
