Invention Grant
- Patent Title: Bolted wafer chuck thermal management systems and methods for wafer processing systems
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Application No.: US16209581Application Date: 2018-12-04
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Publication No.: US10607867B2Publication Date: 2020-03-31
- Inventor: David Benjaminson , Dmitry Lubomirsky , Ananda Seelavanth Math , Saravanakumar Natarajan , Shubham Chourey
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/67 ; H01L21/687 ; H01L21/324 ; H01J37/32

Abstract:
A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.
Public/Granted literature
- US20190109025A1 BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS Public/Granted day:2019-04-11
Information query
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