Invention Grant
- Patent Title: Connection structure between flat cable and electronic circuit board
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Application No.: US15843066Application Date: 2017-12-15
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Publication No.: US10608359B2Publication Date: 2020-03-31
- Inventor: Sung-soo Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KE Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KE Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2017-0049886 20170418
- Main IPC: H01R12/79
- IPC: H01R12/79 ; H01R12/70 ; H01R12/71 ; H01R12/77 ; H01R12/88 ; H05K1/18

Abstract:
A connection structure between a flat cable and an electronic circuit board includes an electronic circuit board; a cable connection hole formed to penetrate the electronic circuit board; a plurality of internal contacts provided on an inner surface of the cable connection hole; and a flat cable provided with a plurality of contacts which correspond to the plurality of internal contacts of the cable connection hole and are exposed to one side surface of the flat cable. When one end of the flat cable is inserted into the cable connection hole of the electronic circuit board, the plurality of contacts of the flat cable are in contact with the plurality of internal contacts of the cable connection hole, respectively.
Public/Granted literature
- US20180175531A1 CONNECTION STRUCTURE BETWEEN FLAT CABLE AND ELECTRONIC CIRCUIT BOARD Public/Granted day:2018-06-21
Information query
IPC分类: