- 专利标题： Polyimide precursor composition, method of preparing polyimide precursor composition, and method of preparing polyimide molded article
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申请号： US15051115申请日： 2016-02-23
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公开(公告)号： US10647881B2公开(公告)日： 2020-05-12
- 发明人: Tomoya Sasaki , Tsuyoshi Miyamoto , Kana Miyazaki , Katsumi Nukada
- 申请人： FUJI XEROX CO., LTD.
- 申请人地址： JP Tokyo
- 专利权人： FUJI XEROX CO., LTD.
- 当前专利权人： FUJI XEROX CO., LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff PLC
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@36ebd8ec
- 主分类号： C09D179/08
- IPC分类号： C09D179/08 ; B29C41/00 ; B29C41/46 ; B29K79/00 ; B29K105/00
摘要：
A polyimide precursor composition in which a resin and an organic amine compound are dispersed in an aqueous solvent, wherein the aqueous solvent contains 50% by weight or more of water and at least one organic solvent selected from a solvent group A consisting of a urea solvent, an amide solvent containing an alkoxy group, and an amide solvent containing an ester group in an amount of 5% by weight or more with respect to the total amount of the aqueous solvent, and the resin has a repeating unit represented by the following formula (I): wherein A indicates a tetravalent organic group, and B indicates a bivalent organic group.
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