Invention Grant
- Patent Title: Aligned particle coating
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Application No.: US15306058Application Date: 2014-04-25
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Publication No.: US10649302B2Publication Date: 2020-05-12
- Inventor: Doris Chun , Napoleon J Leoni
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dicke Billig & Czaja PLLC
- International Application: PCT/US2014/035433 WO 20140425
- International Announcement: WO2015/163911 WO 20151029
- Main IPC: G02F1/167
- IPC: G02F1/167 ; B05D3/06 ; B05D3/00 ; G02F1/1333

Abstract:
A method of manufacturing a coating for an e-paper assembly includes forming a coating layer from conductive particles dispersed within an insulative matrix. A field is applied to cause the conductive particles to align in generally parallel, spaced apart elongate patterns that are generally perpendicular to a plane through which the coating layer extends. At ambient temperatures and without applied pressure, the coating layer is cured via radiation energy while maintaining the applied field.
Public/Granted literature
- US20170052420A1 Aligned Particle Coating Public/Granted day:2017-02-23
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