Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16116681Application Date: 2018-08-29
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Publication No.: US10650949B2Publication Date: 2020-05-12
- Inventor: Hironori Asano , Noriaki Matsuno
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@609d0ca1
- Main IPC: H03K3/282
- IPC: H03K3/282 ; H01F17/00 ; H03H7/01 ; H01L27/06 ; H01L23/522 ; H01L23/66 ; H01L23/64 ; H03H1/00

Abstract:
A semiconductor device capable of reducing in size thereof and suppressing degradation in the characteristics of circuit components is provided. The semiconductor device includes an LC circuit comprised of a spiral inductor provided over a semiconductor substrate and a capacitive element coupled with the spiral inductor. The spiral inductor includes a central area encircled with a metal wiring and a peripheral area other than the central area. The capacitive element is formed in an upper-layer or a lower-layer position corresponding to the peripheral area other than the central area.
Public/Granted literature
- US20190148047A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-05-16
Information query
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