Invention Grant
- Patent Title: Wireless serial links for communications between devices formed in a package
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Application No.: US15090264Application Date: 2016-04-04
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Publication No.: US10651965B2Publication Date: 2020-05-12
- Inventor: Mostafa Naguib Abdulla
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G06F13/38
- IPC: G06F13/38 ; H04L1/00 ; G11C5/02 ; G11C7/10 ; G11C5/04 ; G11C29/28 ; G11C29/00

Abstract:
In various embodiments, a memory module houses memory devices and, in some embodiments, a memory controller. Each of the devices has a near-field interface coupled to loop antennas to communicate over-the-air data. A coil is formed on, for example, a memory device substrate or molded into a plastic mold to create near-field magnetic coupling between the stacked memory devices and, in certain embodiments, the memory controller. Other embodiments are disclosed.
Public/Granted literature
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