Invention Grant
- Patent Title: Valved micronozzle array for high temperature MEMS application
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Application No.: US16243393Application Date: 2019-01-09
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Publication No.: US10654272B2Publication Date: 2020-05-19
- Inventor: Gregory McGraw , Matthew King , William E. Quinn
- Applicant: Universal Display Corporation
- Applicant Address: US NJ Ewing
- Assignee: Universal Display Corporation
- Current Assignee: Universal Display Corporation
- Current Assignee Address: US NJ Ewing
- Agency: Morris & Kamlay LLP
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; H01L51/00 ; B05B1/16 ; H01L51/56

Abstract:
Embodiments of the disclosed subject matter provide a micronozzle array formed from monolithic silicon. The micronozzle array may have a plurality of nozzles, where each nozzle of the plurality of nozzles including an integrated plug valve that allows flow from the nozzle to be attenuated separately from each other nozzle of the plurality of nozzles. Each of the plurality of nozzles may include a microchannel, formed from the monolithic silicon, having a first channel portion and a second channel portion, where the first channel portion is narrower than the second channel portion, and where the first channel portion forms an aperture of the nozzle that is configured to eject vapor from the microchannel. Each of the plurality of nozzles may include a stem, formed from the monolithic silicon that includes the integrated plug valve is suspended in the microchannel to attenuate the flow from the nozzle.
Public/Granted literature
- US20190217610A1 Valved micronozzle array for high temperature MEMS application Public/Granted day:2019-07-18
Information query
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