Invention Grant
- Patent Title: Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method
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Application No.: US15308598Application Date: 2015-04-23
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Publication No.: US10656536B2Publication Date: 2020-05-19
- Inventor: Martinus Hendrikus Antonius Leenders , Niek Elout De Kruijf , Mircea Dusa , Martijn Houben , Johannes Gerardus Maria Mulder , Thomas Poiesz , Marco Adrianus Peter Van Den Heuvel , Paul Van Dongen , Justin Johannes Hermanus Gerritzen , Antonie Hendrik Verweij , Abraham Alexander Soethoudt
- Applicant: ASML Netherlands B.V. , ASML Holding N.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- International Application: PCT/EP2015/058831 WO 20150423
- International Announcement: WO2015/169616 WO 20151112
- Main IPC: B25B11/00
- IPC: B25B11/00 ; G03F7/20 ; H01L21/683

Abstract:
A substrate support, includes: a substrate support location configured to support a substrate, and a vacuum clamping device configured to clamp the substrate on the substrate support location, wherein the vacuum clamping device includes at least one reduced pressure source to create a reduced pressure, at least one vacuum section connected to the at least one reduced pressure source, wherein the at least one vacuum section is configured to attract the substrate towards the substrate support location, and a control device configured to control a spatial pressure profile along the at least one vacuum section with which the substrate is attracted by the vacuum clamping device, wherein the control device includes a substrate shape data input to receive substrate shape data representing shape data of the substrate to be clamped, and wherein the control device is configured to adapt the spatial pressure profile in dependency of the substrate shape data.
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